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Chemical content PMZB290UN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB290UNSOT883BXQFN30.68953 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065866315612601235Hsin-chu, Taiwan; Kwai Chung, Hong Kong; Hsinchu, Taiwan; Dongguan, China; D-22529 HAMBURG, Germany; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33066
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04555
Phenolic resinProprietary0.0004113.530000.05887
subTotal0.00300100.000000.43508
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.80105
subTotal0.04000100.000005.80105
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09746
Copper (Cu)7440-50-80.2632094.0000038.17093
Tin (Sn)7440-31-50.000670.240000.09746
Zinc (Zn)7440-66-60.000590.210000.08528
Pure metal layerGold (Au)7440-57-50.000220.080000.03249
Nickel (Ni)7440-02-00.013834.940002.00600
Palladium (Pd)7440-05-30.000810.290000.11776
subTotal0.28000100.0000040.60738
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.34106
Silica fused60676-86-00.2040060.0000029.58537
Flame retardantMetal hydroxideProprietary0.010203.000001.47927
ImpurityBismuth (Bi)7440-69-90.001700.500000.24654
PigmentCarbon black1333-86-40.001700.500000.24654
PolymerEpoxy resin systemProprietary0.023807.000003.45163
Phenolic resinProprietary0.020406.000002.95854
subTotal0.34000100.0000049.30895
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00161
Tin solderTin (Sn)7440-31-50.0199999.940002.89879
subTotal0.02000100.000002.90053
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0065399.990000.94649
subTotal0.00653100.000000.94658
total0.68953100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.