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Chemical content PMZB390UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB390UNESOT883BXQFN30.69166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068613315312601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32964
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04541
Phenolic resinProprietary0.0004113.530000.05868
subTotal0.00300100.000000.43373
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.78319
subTotal0.04000100.000005.78319
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09716
Copper (Cu)7440-50-80.2632094.0000038.05338
Tin (Sn)7440-31-50.000670.240000.09716
Zinc (Zn)7440-66-60.000590.210000.08501
Pure metal layerGold (Au)7440-57-50.000220.080000.03239
Nickel (Ni)7440-02-00.013834.940001.99983
Palladium (Pd)7440-05-30.000810.290000.11740
subTotal0.28000100.0000040.48233
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.30613
Silica fused60676-86-00.2040060.0000029.49426
Flame retardantMetal hydroxideProprietary0.010203.000001.47471
ImpurityBismuth (Bi)7440-69-90.001700.500000.24579
PigmentCarbon black1333-86-40.001700.500000.24579
PolymerEpoxy resin systemProprietary0.023807.000003.44100
Phenolic resinProprietary0.020406.000002.94943
subTotal0.34000100.0000049.15711
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00160
Tin solderTin (Sn)7440-31-50.0199999.940002.88986
subTotal0.02000100.000002.89159
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0086699.990001.25222
subTotal0.00866100.000001.25235
total0.69166100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.