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Chemical content PMZB950UPEL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB950UPELSOT883BXQFN30.63532 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070911315412601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0030476.000000.47850
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0004210.470000.06592
Phenolic resinProprietary0.0005413.530000.08519
subTotal0.00400100.000000.62961
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.72203
subTotal0.03000100.000004.72203
Lead FrameCopper alloyCopper (Cu)7440-50-80.2494291.0300039.25930
Magnesium (Mg)7439-95-40.000470.170000.07332
Nickel (Ni)7440-02-00.007782.840001.22483
Silicon (Si)7440-21-30.001700.620000.26739
Pure metal layerGold (Au)7440-57-50.000220.080000.03450
Nickel (Ni)7440-02-00.013624.970002.14346
Palladium (Pd)7440-05-30.000790.290000.12507
subTotal0.27400100.0000043.12787
Mould CompoundFillerSilica -amorphous-7631-86-90.0685423.0000010.78826
Silica fused60676-86-00.1788060.0000028.14330
Flame retardantMetal hydroxideProprietary0.008943.000001.40716
ImpurityBismuth (Bi)7440-69-90.001490.500000.23453
PigmentCarbon black1333-86-40.001490.500000.23453
PolymerEpoxy resin systemProprietary0.020867.000003.28338
Phenolic resinProprietary0.017886.000002.81433
subTotal0.29800100.0000046.90549
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000010.055500.00192
Tin solderTin (Sn)7440-31-50.0219999.940003.46074
subTotal0.02200100.000003.46282
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0073299.990001.15206
subTotal0.00732100.000001.15218
total0.63532100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.