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Chemical content PNE20050EP

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Type numberPackagePackage descriptionTotal product weight
PNE20050EPSOD128FlatPower33.30500 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661633115212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.20800100.000003.62708
subTotal1.20800100.000003.62708
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.64238
Iron (Fe)7439-89-60.005220.100000.01566
Phosphorus (P)7723-14-00.002090.040000.00627
subTotal5.21700100.0000015.66431
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200034.92942
Iron (Fe)7439-89-60.011820.100000.03549
Phosphorus (P)7723-14-00.003550.030000.01065
Pure metal layerSilver (Ag)7440-22-40.171391.450000.51461
subTotal11.82000100.0000035.49017
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.66612
Silica fused60676-86-09.1575075.0000027.49587
PigmentCarbon black1333-86-40.036630.300000.10998
PolymerEpoxy resin systemProprietary0.940177.700002.82291
Phenolic resinProprietary0.854707.000002.56628
subTotal12.21000100.0000036.66116
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.05079
subTotal0.35000100.000001.05089
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.94340
Silver alloySilver (Ag)7440-22-40.062502.500000.18766
Tin alloyTin (Sn)7440-31-50.125005.000000.37532
subTotal2.50000100.000007.50638
total33.30500100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.