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Chemical content PNE20060EPE-Q

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Type numberPackagePackage descriptionTotal product weight
PNE20060EPE-QSOT1289BCFP1573.05000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662613139312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.44000100.000001.97125
subTotal1.44000100.000001.97125
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.05615
Iron (Fe)7439-89-60.011040.150000.01511
Phosphorus (P)7723-14-00.002940.040000.00403
subTotal7.36000100.0000010.07529
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.12080
Iron (Fe)7439-89-60.034470.100000.04719
Phosphorus (P)7723-14-00.013790.040000.01887
subTotal34.47000100.0000047.18686
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.82820
Silica fused60676-86-015.4950075.0000021.21150
PigmentCarbon black1333-86-40.061980.300000.08485
PolymerEpoxy resin systemProprietary1.590827.700002.17771
Phenolic resinProprietary1.446207.000001.97974
subTotal20.66000100.0000028.28200
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12319
subTotal0.09000100.000000.12320
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.80513
Silver alloySilver (Ag)7440-22-40.225752.500000.30903
Tin alloyTin (Sn)7440-31-50.180602.000000.24723
subTotal9.03000100.0000012.36139
total73.05000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.