Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PNE650100EJ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934665986118PNE650100EJJPNE650100EJSOT8018 (TO263-2L)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 6282 ppm of the article. SCIP No. f8fd1871-86a2-4364-a382-bb3e3e5c862c.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔点焊料 (如铅含量超过85%(重量百分比)的铅基合金焊料)'.
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 6282 ppm; substance 7440-02-0: 164 ppm; substance 1333-86-4: 2184 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 6282 ppm; substance 7440-02-0: 164 ppm; substance 1333-86-4: 2184 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 101 ppm;
RHF IndicatorContains EU/CN RoHS-exempted lead and is halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-32.060000100.0000000.142653
Die Total2.060000100.0000000.142653
Lead FrameCopper alloyCopper (Cu)7440-50-8788.50189899.85840054.603182
Lead FrameCopper alloyIron (Fe)7439-89-60.5527340.0700000.038277
Lead FrameCopper alloyPhosphorus (P)7723-14-00.1974050.0250000.013670
Lead FrameImpurityLead (Pb)7439-92-10.0126340.0016000.000875
Base Alloy C19210 Total789.26467199.95500054.656004
Lead FrameNickel alloyPhosphorus (P)7723-14-00.1184430.0150000.008202
Lead FrameNickel alloyNickel (Ni)7440-02-00.0789620.0100000.005468
Pre-Plating 1 Total0.1974050.0250000.013670
Lead FramePure metal layerNickel (Ni)7440-02-00.1579240.0200000.010936
Pre-Plating 2 Total0.1579240.0200000.010936
Lead Frame Total789.620000100.00000054.680610
Mould CompoundFillerSilica fused60676-86-0473.23500075.00000032.771179
Mould CompoundFillerSilica7631-86-994.64700015.0000006.554236
Mould CompoundPolymerEpoxy resin system47.3235007.5000003.277118
Mould CompoundPolymerPhenolic resin12.6196002.0000000.873898
Mould CompoundPigmentCarbon black1333-86-43.1549000.5000000.218474
Mould Compound Total630.980000100.00000043.694905
Post-PlatingPure metal layerTin (Sn)7440-31-58.67913299.9900000.601024
Post-PlatingImpurityNon-declarable0.0008680.0100000.000060
Post-Plating Total8.680000100.0000000.601084
WirePure metalAluminium (Al)7429-90-53.02811599.9900000.209695
WireImpurityNickel (Ni)7440-02-00.0001820.0060000.000013
WireImpurityIron (Fe)7439-89-60.0000310.0010000.000002
WireImpurityCopper (Cu)7440-50-80.0000300.0010000.000002
WireImpurityMagnesium (Mg)7439-95-40.0000300.0010000.000002
WireImpuritySilicon (Si)7440-21-30.0000300.0010000.000002
Wire Total3.028418100.0000000.209716
Chip CoatPolymer3-Aminopropyltrihydroxysilane58160-99-90.000100100.0000000.000007
Chip Coat Total0.000100100.0000000.000007
Solder WireLead alloyLead (Pb)7439-92-19.06015093.5000000.627409
Solder WireLead alloyTin (Sn)7440-31-50.4845005.0000000.033551
Solder WireLead alloySilver (Ag)7440-22-40.1453501.5000000.010065
Solder Wire Total9.690000100.0000000.671025
PNE650100EJ Total1444.058518100.000000
Notes
Report created on 2025-12-01 08:59:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
245 °C40 s220 °C30 s3
Notes
Report created on 2025-12-01 08:59:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层1 (Pre-Plating 1)
预镀层2 (Pre-Plating 2)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
芯片涂层 (Chip Coat)
焊锡丝 (Solder Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
EFUP Icon 该半导体产品的环保使用期限(EFUP)为50年。
This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Notes
Report created on 2025-12-01 08:59:21 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.