Chemical content PQMD16

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Type numberPackagePackage descriptionTotal product weight
PQMD16SOT1216DFN1010B-61.23563 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934069749147312601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01780
FillerSilver (Ag)7440-22-40.0184884.000001.49559
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.17805
Isobornyl Methacrylate7534-94-30.001105.000000.08902
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.23722
DieDoped siliconSilicon (Si)7440-21-30.04000100.000003.23722
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.23203
Magnesium (Mg)7439-95-40.000830.170000.06755
Nickel (Ni)7440-02-00.013942.840001.12853
Silicon (Si)7440-21-30.003040.620000.24637
Pure metal layerGold (Au)7440-57-50.000340.070000.02782
Nickel (Ni)7440-02-00.023034.690001.86366
Palladium (Pd)7440-05-30.002110.430000.17087
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.28008
Silica fused60676-86-00.3636060.0000029.42628
Flame retardantMetal hydroxideProprietary0.018183.000001.47131
ImpurityBismuth (Bi)7440-69-90.003030.500000.24522
PigmentCarbon black1333-86-40.003030.500000.24522
PolymerEpoxy resin systemProprietary0.042427.000003.43307
Phenolic resinProprietary0.036366.000002.94263
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00108
Tin solderTin (Sn)7440-31-50.0239999.940001.94116
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0126399.990001.02181
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.