×

Chemical content PQMH9

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PQMH9SOT1216DFN1010B-61.21713 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069742147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01808
FillerSilver (Ag)7440-22-40.0184884.000001.51833
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18075
Isobornyl Methacrylate7534-94-30.001105.000000.09038
subTotal0.02200100.000001.80754
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.92963
subTotal0.06000100.000004.92963
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.78274
Magnesium (Mg)7439-95-40.000830.170000.06858
Nickel (Ni)7440-02-00.013942.840001.14568
Silicon (Si)7440-21-30.003040.620000.25011
Pure metal layerGold (Au)7440-57-50.000340.070000.02824
Nickel (Ni)7440-02-00.023034.690001.89198
Palladium (Pd)7440-05-30.002110.430000.17347
subTotal0.49100100.0000040.34080
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.45153
Silica fused60676-86-00.3636060.0000029.87356
Flame retardantMetal hydroxideProprietary0.018183.000001.49368
ImpurityBismuth (Bi)7440-69-90.003030.500000.24895
PigmentCarbon black1333-86-40.003030.500000.24895
PolymerEpoxy resin systemProprietary0.042427.000003.48525
Phenolic resinProprietary0.036366.000002.98736
subTotal0.60600100.0000049.78928
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00109
Tin solderTin (Sn)7440-31-50.0239999.940001.97067
subTotal0.02400100.000001.97185
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0141399.990001.16112
subTotal0.01413100.000001.16124
total1.21713100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.