Chemical content PQMH9

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Type numberPackagePackage descriptionTotal product weight
PQMH9SOT1216DFN1010B-61.21713 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934069742147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01808
FillerSilver (Ag)7440-22-40.0184884.000001.51833
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18075
Isobornyl Methacrylate7534-94-30.001105.000000.09038
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.92963
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.78274
Magnesium (Mg)7439-95-40.000830.170000.06858
Nickel (Ni)7440-02-00.013942.840001.14568
Silicon (Si)7440-21-30.003040.620000.25011
Pure metal layerGold (Au)7440-57-50.000340.070000.02824
Nickel (Ni)7440-02-00.023034.690001.89198
Palladium (Pd)7440-05-30.002110.430000.17347
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.45153
Silica fused60676-86-00.3636060.0000029.87356
Flame retardantMetal hydroxideProprietary0.018183.000001.49368
ImpurityBismuth (Bi)7440-69-90.003030.500000.24895
PigmentCarbon black1333-86-40.003030.500000.24895
PolymerEpoxy resin systemProprietary0.042427.000003.48525
Phenolic resinProprietary0.036366.000002.98736
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00109
Tin solderTin (Sn)7440-31-50.0239999.940001.97067
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0141399.990001.16112
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.