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Chemical content PSC1065H

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Type numberPackagePackage descriptionTotal product weight
PSC1065HSOT8017TO252-2L320.66182 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662645118712601235Dresden, Germany; Lubbock, United States Of America; D-22529 HAMBURG, Germany; Weihai, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon Carbide (SiC)409-21-20.81700100.000000.25479
subTotal0.81700100.000000.25479
Lead FrameCopper alloyCopper (Cu)7440-50-8150.6596999.7086046.98398
Iron (Fe)7439-89-60.226650.150000.07068
Phosphorus (P)7723-14-00.045330.030000.01414
ImpurityLead (Pb)7439-92-10.002120.001400.00066
Nickel alloyNickel (Ni)7440-02-00.052880.035000.01649
Phosphorus (P)7723-14-00.022660.015000.00707
Pure metal layerNickel (Ni)7440-02-00.090660.060000.02827
subTotal151.10000100.0000047.12129
Mould CompoundFillerSilica -amorphous-7631-86-923.1945015.000007.23332
Silica fused60676-86-0115.9725075.0000036.16661
PigmentCarbon black1333-86-40.773150.500000.24111
PolymerEpoxy resin systemProprietary11.597257.500003.61666
Phenolic resinProprietary3.092602.000000.96444
subTotal154.63000100.0000048.22214
Post-PlatingImpurityNon hazardousProprietary0.000500.010000.00016
Tin solderTin (Sn)7440-31-54.9795099.990001.55288
subTotal4.98000100.000001.55304
Solder WireLead alloyLead (Pb)7439-92-17.5267593.500002.34725
Silver (Ag)7440-22-40.120751.500000.03766
Tin (Sn)7440-31-50.402505.000000.12552
subTotal8.05000100.000002.51043
WireImpurityCopper (Cu)7440-50-80.000010.001000.00000
Iron (Fe)7439-89-60.000010.001000.00000
Magnesium (Mg)7439-95-40.000010.001000.00000
Nickel (Ni)7440-02-00.000070.006000.00002
Silicon (Si)7440-21-30.000010.001000.00000
Pure metalAluminium (Al)7429-90-51.0847199.990000.33827
subTotal1.08482100.000000.33829
total320.66182100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.