Chemical content PSMN015-100YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN015-100YSFSOT669LFPAK72.32000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662282115212601260Cabuyao, Philippines; Cardiff, Great Britain; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.73000100.000002.39215
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.90456
Iron (Fe)7439-89-60.005000.099910.00691
Phosphorus (P)7723-14-00.001620.032470.00224
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100052.32020
Iron (Fe)7439-89-60.056860.150000.07863
Phosphorus (P)7723-14-00.015160.040000.02097
Mould CompoundFillerSilica -amorphous-7631-86-92.2290010.000003.08213
Silica fused60676-86-016.7175075.0000023.11601
PigmentCarbon black1333-86-40.066870.300000.09246
PolymerEpoxy resin systemProprietary1.716337.700002.37324
Phenolic resinProprietary1.560307.000002.15749
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00053
Tin alloyTin (Sn)7440-31-53.8496299.990005.32303
Solder PasteLead alloyLead (Pb)7439-92-10.9805092.500001.35578
Silver (Ag)7440-22-40.026502.500000.03664
Tin (Sn)7440-31-50.053005.000000.07329
Solder PasteImpurityAntimony (Sb)7440-36-00.000140.030000.00020
Lead alloyLead (Pb)7439-92-10.4438692.470000.61374
Silver alloySilver (Ag)7440-22-40.012002.500000.01659
Tin alloyTin (Sn)7440-31-50.024005.000000.03319
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.