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Chemical content PSMN047-100NSE

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Type numberPackagePackage descriptionTotal product weight
PSMN047-100NSESOT1220-2DFN2020M-67.30390 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663730115412601260Dongguan, China; Cardiff, Great Britain; Manchester, United Kingdom; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01588
FillerSilver (Ag)7440-22-40.0974484.000001.33408
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.15882
Isobornyl Methacrylate7534-94-30.005805.000000.07941
subTotal0.11600100.000001.58819
DieDoped siliconSilicon (Si)7440-21-30.66000100.000009.03627
subTotal0.66000100.000009.03627
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300036.85681
Magnesium (Mg)7439-95-40.004220.150000.05781
Nickel (Ni)7440-02-00.083892.980001.14852
Silicon (Si)7440-21-30.018300.650000.25052
Pure metal layerGold (Au)7440-57-50.000280.010000.00385
Nickel (Ni)7440-02-00.015480.550000.21198
Palladium (Pd)7440-05-30.000840.030000.01156
subTotal2.81500100.0000038.54105
Mould CompoundAdditiveNon hazardousProprietary0.014830.410000.20309
FillerSilica -amorphous-7631-86-90.010490.290000.14365
Silica fused60676-86-03.1169186.1500042.67456
HardenerPhenolic resinProprietary0.155214.290002.12506
PigmentCarbon black1333-86-40.006870.190000.09412
PolymerEpoxy resin systemProprietary0.313688.670004.29470
subTotal3.61800100.0000049.53518
WireImpurityNon hazardousProprietary0.000010.010000.00013
Pure metalCopper (Cu)7440-50-80.0949099.990001.29924
subTotal0.09490100.000001.29937
total7.30390100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.