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Chemical content PSMN071-100NSE

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Type numberPackagePackage descriptionTotal product weight
PSMN071-100NSESOT1220-2DFN2020M-67.14718 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663731115512601235Dongguan, China; Manchester, United Kingdom; Cardiff, Great Britain; Sherman, United States Of America 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01623
FillerSilver (Ag)7440-22-40.0974484.000001.36333
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16230
Isobornyl Methacrylate7534-94-30.005805.000000.08115
subTotal0.11600100.000001.62301
DieDoped siliconSilicon (Si)7440-21-30.50328100.000007.04166
subTotal0.50328100.000007.04166
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300037.66499
Magnesium (Mg)7439-95-40.004220.150000.05908
Nickel (Ni)7440-02-00.083892.980001.17371
Silicon (Si)7440-21-30.018300.650000.25601
Pure metal layerGold (Au)7440-57-50.000280.010000.00394
Nickel (Ni)7440-02-00.015480.550000.21662
Palladium (Pd)7440-05-30.000840.030000.01182
subTotal2.81500100.0000039.38617
Mould CompoundAdditiveNon hazardousProprietary0.014830.410000.20755
FillerSilica -amorphous-7631-86-90.010490.290000.14680
Silica fused60676-86-03.1169186.1500043.61031
HardenerPhenolic resinProprietary0.155214.290002.17166
PigmentCarbon black1333-86-40.006870.190000.09618
PolymerEpoxy resin systemProprietary0.313688.670004.38887
subTotal3.61800100.0000050.62137
WireImpurityNon hazardousProprietary0.000010.010000.00013
Pure metalCopper (Cu)7440-50-80.0949099.990001.32773
subTotal0.09490100.000001.32786
total7.14718100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.