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Chemical content PSMN0R9-30YLD/2

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Type numberPackagePackage descriptionTotal product weight
PSMN0R9-30YLD/2SOT10234 LEADS118.78000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667507115112601260Hsin-chu, Taiwan; Cabuyao, Philippines; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-35.10000100.000004.29365
subTotal5.10000100.000004.29365
ClipCopper alloyCopper (Cu)7440-50-827.3637399.8676223.03732
Iron (Fe)7439-89-60.027380.099910.02305
Phosphorus (P)7723-14-00.008900.032470.00749
subTotal27.40000100.0000023.06786
Lead FrameCopper alloyCopper (Cu)7440-50-840.3474899.8700033.96824
Iron (Fe)7439-89-60.040400.100000.03401
Phosphorus (P)7723-14-00.012120.030000.01020
subTotal40.40000100.0000034.01245
Mould CompoundFillerSilica fused60676-86-021.5414071.0000018.13554
PigmentCarbon black1333-86-40.091020.300000.07663
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-25.9769819.700005.03198
Phenolic resinProprietary2.730609.000002.29887
subTotal30.34000100.0000025.54302
Post-PlatingImpurityNon hazardousProprietary0.000170.010000.00015
Tin alloyTin (Sn)7440-31-51.7298399.990001.45633
subTotal1.73000100.000001.45648
Solder PasteLead alloyLead (Pb)7439-92-13.8387592.500003.23182
Silver (Ag)7440-22-40.103752.500000.08735
Tin (Sn)7440-31-50.207505.000000.17469
subTotal4.15000100.000003.49386
Solder PasteImpurityAntimony (Sb)7440-36-00.002900.030000.00244
Lead alloyLead (Pb)7439-92-18.9326092.470007.52029
Silver (Ag)7440-22-40.241502.500000.20332
Tin (Sn)7440-31-50.483005.000000.40663
subTotal9.66000100.000008.13268
total118.78000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.