Chemical content PSMN1R0-40SSH

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Type number	Package	Package description	Total product weight
PSMN1R0-40SSH	SOT1235	LFPAK88	346.07000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934660688118	4	1	260		1	260			Newport, United Kingdom; Manchester, United Kingdom; Cabuyao, Philippines; Hsin-chu, Taiwan; Seremban, Malaysia

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	1.90000	100.00000	0.54902
		subTotal		1.90000	100.00000	0.54902

Clip	Copper alloy	Copper (Cu)	7440-50-8	47.13392	99.86000	13.61976
		Iron (Fe)	7439-89-6	0.05192	0.11000	0.01500
		Phosphorus (P)	7723-14-0	0.01416	0.03000	0.00409
		subTotal		47.20000	100.00000	13.63885

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	172.92756	99.86000	49.96895
		Iron (Fe)	7439-89-6	0.22512	0.13000	0.06505
		Phosphorus (P)	7723-14-0	0.05195	0.03000	0.01501
		subTotal		173.17000	100.00000	50.04901

Mould Compound	Filler	Silica fused	60676-86-0	63.33300	62.00000	18.30063
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	15.83325	15.50000	4.57516
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.20430	0.20000	0.05903
	Pigment	Carbon black	1333-86-4	0.51075	0.50000	0.14759
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	11.23650	11.00000	3.24689
		Phenolic resin	Proprietary	8.98920	8.80000	2.59751
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	2.04300	2.00000	0.59034
		subTotal		102.15000	100.00000	29.51715

Post-Plating	Impurity	Non hazardous	Proprietary	0.00049	0.01000	0.00014
	Tin alloy	Tin (Sn)	7440-31-5	4.87951	99.99000	1.40998
		subTotal		4.88000	100.00000	1.41012

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00355	0.03000	0.00102
	Lead alloy	Lead (Pb)	7439-92-1	10.92995	92.47000	3.15831
		Silver (Ag)	7440-22-4	0.29550	2.50000	0.08539
		Tin (Sn)	7440-31-5	0.59100	5.00000	0.17077
		subTotal		11.82000	100.00000	3.41549

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00198	0.04000	0.00057
	Lead alloy	Lead (Pb)	7439-92-1	4.57726	92.47000	1.32264
	Silver alloy	Silver (Ag)	7440-22-4	0.12375	2.50000	0.03576
	Tin alloy	Tin (Sn)	7440-31-5	0.24750	5.00000	0.07152
		subTotal		4.95000	100.00000	1.43049

		total		346.07000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.