Chemical content PSMN1R2-55SLH

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Type numberPackagePackage descriptionTotal product weight
PSMN1R2-55SLHSOT1235LFPAK88355.96400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346613021183126030 s124020 s3Cabuyao, Philippines; Hsin-chu, Taiwan; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.49000100.000000.98044
ClipCopper alloyCopper (Cu)7440-50-860.2095999.8600016.91452
Iron (Fe)7439-89-60.066320.110000.01863
Phosphorus (P)7723-14-00.018090.030000.00508
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600048.58007
Iron (Fe)7439-89-60.225120.130000.06324
Phosphorus (P)7723-14-00.051950.030000.01459
Mould CompoundFillerSilica fused60676-86-063.3330062.0000017.79197
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.44799
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05739
PigmentCarbon black1333-86-40.510750.500000.14348
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.57393
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.15664
Phenolic resinProprietary8.989208.800002.52531
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.37079
Solder PasteImpurityAntimony (Sb)7440-36-00.001600.030000.00045
Lead alloyLead (Pb)7439-92-14.9286592.470001.38459
Silver (Ag)7440-22-40.133252.500000.03743
Tin (Sn)7440-31-50.266505.000000.07487
Solder PasteImpurityAntimony (Sb)7440-36-00.002660.040000.00075
Lead alloyLead (Pb)7439-92-16.1492692.470001.72749
Silver alloySilver (Ag)7440-22-40.166252.500000.04670
Tin alloyTin (Sn)7440-31-50.332505.000000.09341
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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