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Chemical content PSMN1R7-30YL

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
PSMN1R7-30YLSOT669LFPAK85.80000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406306811510126030 s126020 s3Manchester, United Kingdom; Hsin-chu, Taiwan; Seremban, Malaysia; Sherman, United States Of America; Cabuyao, Philippines; Dongguan, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.10000100.000004.77855
subTotal4.10000100.000004.77855
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.81979
Iron (Fe)7439-89-60.005000.099910.00582
Phosphorus (P)7723-14-00.001620.032470.00189
subTotal5.00000100.000005.82750
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100044.10020
Iron (Fe)7439-89-60.056860.150000.06628
Phosphorus (P)7723-14-00.015160.040000.01767
subTotal37.91000100.0000044.18415
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.01783
Flame retardantZinc Borate138265-88-02.2530010.000002.62587
PigmentCarbon black1333-86-40.067590.300000.07878
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.17297
Phenolic resinProprietary2.027709.000002.36329
subTotal22.53000100.0000026.25874
Post-PlatingPure metalTin (Sn)7440-31-53.85000100.000004.48718
subTotal3.85000100.000004.48718
Solder PasteLead alloyLead (Pb)7439-92-13.4502592.500004.02127
Silver (Ag)7440-22-40.093252.500000.10868
Tin (Sn)7440-31-50.186505.000000.21737
subTotal3.73000100.000004.34732
Solder PasteImpurityAntimony (Sb)7440-36-00.002600.030000.00303
Lead alloyLead (Pb)7439-92-18.0264092.470009.35477
Silver (Ag)7440-22-40.217002.500000.25291
Tin (Sn)7440-31-50.434005.000000.50583
subTotal8.68000100.0000010.11654
total85.80000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.