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Chemical content PSMN2R6-80YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN2R6-80YSFSOT10234 LEADS103.50560 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666120115212601260Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.61560100.000002.52701
subTotal2.61560100.000002.52701
ClipCopper alloyCopper (Cu)7440-50-822.4907299.8700021.72899
Iron (Fe)7439-89-60.022520.100000.02176
Phosphorus (P)7723-14-00.006760.030000.00653
subTotal22.52000100.0000021.75728
Lead FrameCopper alloyCopper (Cu)7440-50-840.3474899.8700038.98096
Iron (Fe)7439-89-60.040400.100000.03903
Phosphorus (P)7723-14-00.012120.030000.01171
subTotal40.40000100.0000039.03170
Mould CompoundFillerSilica -amorphous-7631-86-94.6050015.000004.44903
Silica fused60676-86-022.8715074.5000022.09687
PigmentCarbon black1333-86-40.153500.500000.14830
PolymerEpoxy resin systemProprietary1.535005.000001.48301
Phenolic resinProprietary1.535005.000001.48301
subTotal30.70000100.0000029.66022
Post-PlatingImpurityNon hazardousProprietary0.000170.010000.00017
Tin alloyTin (Sn)7440-31-51.7298399.990001.67124
subTotal1.73000100.000001.67141
Solder PasteImpurityAntimony (Sb)7440-36-00.000970.030000.00094
Lead alloyLead (Pb)7439-92-12.9960392.470002.89456
Silver (Ag)7440-22-40.081002.500000.07826
Tin (Sn)7440-31-50.162005.000000.15651
subTotal3.24000100.000003.13027
Solder PasteImpurityAntimony (Sb)7440-36-00.000690.030000.00067
Lead alloyLead (Pb)7439-92-12.1268192.470002.05478
Silver alloySilver (Ag)7440-22-40.057502.500000.05555
Tin alloyTin (Sn)7440-31-50.115005.000000.11111
subTotal2.30000100.000002.22211
total103.50560100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.