Chemical content PSMN2R9-100SSE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN2R9-100SSESOT1235LFPAK88342.78140 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661731118312601260Seremban, Malaysia; Cabuyao, Philippines; Cardiff, Great Britain; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-38.10840100.000002.36547
ClipCopper alloyCopper (Cu)7440-50-846.7774299.8600013.64643
Iron (Fe)7439-89-60.051530.110000.01503
Phosphorus (P)7723-14-00.014050.030000.00410
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600050.44835
Iron (Fe)7439-89-60.225120.130000.06567
Phosphorus (P)7723-14-00.051950.030000.01516
Mould CompoundFillerSilica fused60676-86-063.3330062.0000018.47621
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.61905
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05960
PigmentCarbon black1333-86-40.510750.500000.14900
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.27804
Phenolic resinProprietary8.989208.800002.62243
Tetramethylbiphenyl diglycidyl ether85954-11-62.043002.000000.59601
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.42351
Solder PasteImpurityAntimony (Sb)7440-36-00.001610.030000.00047
Lead alloyLead (Pb)7439-92-14.9563992.470001.44593
Silver (Ag)7440-22-40.134002.500000.03909
Tin (Sn)7440-31-50.268005.000000.07818
Solder PasteImpurityAntimony (Sb)7440-36-00.000680.030000.00020
Lead alloyLead (Pb)7439-92-12.0990792.470000.61236
Silver alloySilver (Ag)7440-22-40.056752.500000.01656
Tin alloyTin (Sn)7440-31-50.113505.000000.03311
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.