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Chemical content PSMN2R9-100SSE

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Type numberPackagePackage descriptionTotal product weight
PSMN2R9-100SSESOT1235LFPAK88336.30140 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661731118512601260Seremban, Malaysia; Cabuyao, Philippines; Cardiff, Great Britain; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-38.10840100.000002.41105
subTotal8.10840100.000002.41105
ClipCopper alloyCopper (Cu)7440-50-846.7774299.8600013.90937
Iron (Fe)7439-89-60.051530.110000.01532
Phosphorus (P)7723-14-00.014050.030000.00418
subTotal46.84300100.0000013.92887
Lead FrameCopper alloyCopper (Cu)7440-50-8172.5480999.8600051.30758
Iron (Fe)7439-89-60.224630.130000.06679
Phosphorus (P)7723-14-00.051840.030000.01541
subTotal172.79000100.0000051.38978
Mould CompoundFillerSilica -amorphous-7631-86-914.4075015.000004.28410
Silica fused60676-86-071.5572574.5000021.27771
PigmentCarbon black1333-86-40.480250.500000.14280
PolymerEpoxy resin systemProprietary4.802505.000001.42803
Phenolic resinProprietary4.802505.000001.42803
subTotal96.05000100.0000028.56067
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00015
Tin alloyTin (Sn)7440-31-54.8795199.990001.45093
subTotal4.88000100.000001.45108
Solder PasteImpurityAntimony (Sb)7440-36-00.001610.030000.00048
Lead alloyLead (Pb)7439-92-14.9563992.470001.47379
Silver (Ag)7440-22-40.134002.500000.03985
Tin (Sn)7440-31-50.268005.000000.07969
subTotal5.36000100.000001.59381
Solder PasteImpurityAntimony (Sb)7440-36-00.000680.030000.00020
Lead alloyLead (Pb)7439-92-12.0990792.470000.62416
Silver alloySilver (Ag)7440-22-40.056752.500000.01687
Tin alloyTin (Sn)7440-31-50.113505.000000.03375
subTotal2.27000100.000000.67498
total336.30140100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.