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Chemical content PSMN3R3-80YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN3R3-80YSFSOT669LFPAK75.62910 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666316115412601260Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.09910100.000002.77551
subTotal2.09910100.000002.77551
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.59799
Iron (Fe)7439-89-60.007500.150000.00992
Phosphorus (P)7723-14-00.002500.050000.00331
subTotal5.00000100.000006.61122
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100050.03097
Iron (Fe)7439-89-60.056860.150000.07519
Phosphorus (P)7723-14-00.015160.040000.02005
subTotal37.91000100.0000050.12621
Mould CompoundFillerSilica -amorphous-7631-86-92.2290010.000002.94728
Silica fused60676-86-016.7175075.0000022.10459
PigmentCarbon black1333-86-40.066870.300000.08842
PolymerEpoxy resin systemProprietary1.716337.700002.26940
Phenolic resinProprietary1.560307.000002.06309
subTotal22.29000100.0000029.47278
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00051
Tin alloyTin (Sn)7440-31-53.8496299.990005.09012
subTotal3.85000100.000005.09063
Solder PasteImpurityAntimony (Sb)7440-36-00.000810.030000.00107
Lead alloyLead (Pb)7439-92-12.4966992.470003.30123
Silver (Ag)7440-22-40.067502.500000.08925
Tin (Sn)7440-31-50.135005.000000.17850
subTotal2.70000100.000003.57005
Solder PasteImpurityAntimony (Sb)7440-36-00.000530.030000.00071
Lead alloyLead (Pb)7439-92-11.6459792.470002.17637
Silver alloySilver (Ag)7440-22-40.044502.500000.05884
Tin alloyTin (Sn)7440-31-50.089005.000000.11768
subTotal1.78000100.000002.35360
total75.62910100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.