Chemical content PSMN4R0-60YS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN4R0-60YSSOT669LFPAK85.77000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934064465115812601260Dongguan, China; Manchester, United Kingdom; Seremban, Malaysia; Hsin-chu, Taiwan; Cabuyao, Philippines; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.10000100.000004.78023
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.82183
Iron (Fe)7439-89-60.005000.099910.00582
Phosphorus (P)7723-14-00.001620.032470.00189
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700044.10721
Iron (Fe)7439-89-60.037880.100000.04416
Phosphorus (P)7723-14-00.011360.030000.01325
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.02343
Flame retardantZinc Borate138265-88-02.2530010.000002.62679
PigmentCarbon black1333-86-40.067590.300000.07880
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.17478
Phenolic resinProprietary2.027709.000002.36411
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00045
Tin alloyTin (Sn)7440-31-53.8496299.990004.48830
Solder PasteLead alloyLead (Pb)7439-92-13.4502592.500004.02268
Silver (Ag)7440-22-40.093252.500000.10872
Tin (Sn)7440-31-50.186505.000000.21744
Solder PasteImpurityAntimony (Sb)7440-36-00.002600.030000.00304
Lead alloyLead (Pb)7439-92-18.0264092.470009.35805
Silver (Ag)7440-22-40.217002.500000.25300
Tin (Sn)7440-31-50.434005.000000.50600
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.