Chemical content PSMNR56-25YLE

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number	Package	Package description	Total product weight
PSMNR56-25YLE	SOT1023	4 LEADS	122.31000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934664058115	2	1	260	30 s	1	260	20 s	3	Hsin-chu, Taiwan; Cabuyao, Philippines

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	1.77000	100.00000	1.44714
		subTotal		1.77000	100.00000	1.44714

Clip	Copper alloy	Copper (Cu)	7440-50-8	27.34520	99.80000	22.35729
		Iron (Fe)	7439-89-6	0.04110	0.15000	0.03360
		Phosphorus (P)	7723-14-0	0.01370	0.05000	0.01120
		subTotal		27.40000	100.00000	22.40209

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	40.34748	99.87000	32.98788
		Iron (Fe)	7439-89-6	0.04040	0.10000	0.03303
		Phosphorus (P)	7723-14-0	0.01212	0.03000	0.00991
		subTotal		40.40000	100.00000	33.03082

Mould Compound	Filler	Silica fused	60676-86-0	18.81080	62.00000	15.37961
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	4.70270	15.50000	3.84490
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.06068	0.20000	0.04961
	Pigment	Carbon black	1333-86-4	0.15170	0.50000	0.12403
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	3.33740	11.00000	2.72864
		Phenolic resin	Proprietary	2.66992	8.80000	2.18291
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.60680	2.00000	0.49612
		subTotal		30.34000	100.00000	24.80582

Post-Plating	Pure metal	Tin (Sn)	7440-31-5	1.73000	100.00000	1.41444
		subTotal		1.73000	100.00000	1.41444

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	7.47400	92.50000	6.11070
		Silver (Ag)	7440-22-4	0.20200	2.50000	0.16515
		Tin (Sn)	7440-31-5	0.40400	5.00000	0.33031
		subTotal		8.08000	100.00000	6.60616

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00504	0.04000	0.00412
	Lead alloy	Lead (Pb)	7439-92-1	11.64197	92.47000	9.51841
	Silver alloy	Silver (Ag)	7440-22-4	0.31475	2.50000	0.25734
	Tin alloy	Tin (Sn)	7440-31-5	0.62950	5.00000	0.51468
		subTotal		12.59000	100.00000	10.29455

		total		122.31000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

China RoHS Information

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Die 晶粒	O	O	O	O	O	O
Clip 夹式极片	O	O	O	O	O	O
Lead Frame 引线框	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Post-Plating 后电镀	O	O	O	O	O	O
Solder Paste 锡膏	O	O	O	O	O	O
Solder Paste 锡膏	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.

disclaimer 免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

disclaimer
免责声明

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.