×

Chemical content PSSI2021SAY

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSSI2021SAYSOT353UMT55.48526 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340565641151312601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.24000100.000004.37536
subTotal0.24000100.000004.37536
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001790.090000.03265
Carbon (C)7440-44-00.000800.040000.01451
Chromium (Cr)7440-47-30.004180.210000.07619
Cobalt (Co)7440-48-40.008360.420000.15237
Iron (Fe)7439-89-60.9378947.1300017.09831
Manganese (Mn)7439-96-50.016920.850000.30837
Nickel (Ni)7440-02-00.7066535.5100012.88269
Phosphorus (P)7723-14-00.000400.020000.00726
Silicon (Si)7440-21-30.004980.250000.09070
Sulphur (S)7704-34-90.000400.020000.00726
Pure metal layerCopper (Cu)7440-50-80.2593013.030004.72716
Silver (Ag)7440-22-40.048362.430000.88158
subTotal1.99000100.0000036.27905
Mould CompoundFillerSilica fused60676-86-02.0803071.0000037.92528
PigmentCarbon black1333-86-40.008790.300000.16025
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5772119.7000010.52293
Phenolic resinProprietary0.263709.000004.80743
subTotal2.93000100.0000053.41589
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.65094
subTotal0.31000100.000005.65151
WirePure metalGold (Au)7440-57-50.01526100.000000.27820
subTotal0.01526100.000000.27820
total5.48526100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.