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Chemical content PUMB20

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Type numberPackagePackage descriptionTotal product weight
PUMB20SOT363SC-885.51393 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340578881151512601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000002.53902
subTotal0.14000100.000002.53902
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03379
Carbon (C)7440-44-00.000830.040000.01502
Chromium (Cr)7440-47-30.004350.210000.07884
Cobalt (Co)7440-48-40.008900.430000.16143
Iron (Fe)7439-89-60.9811847.4000017.79457
Manganese (Mn)7439-96-50.017600.850000.31910
Nickel (Ni)7440-02-00.7392035.7100013.40599
Phosphorus (P)7723-14-00.000410.020000.00751
Silicon (Si)7440-21-30.005380.260000.09761
Sulphur (S)7704-34-90.000410.020000.00751
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.92166
Silver (Ag)7440-22-40.038501.860000.69827
subTotal2.07000100.0000037.54130
Mould CompoundFillerSilica fused60676-86-02.1929275.1000039.77054
PigmentCarbon black1333-86-40.008760.300000.15887
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.26744
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.75993
subTotal2.92000100.0000052.95678
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.70961
subTotal0.37000100.000006.71029
WirePure metalCopper (Cu)7440-50-80.01393100.000000.25266
subTotal0.01393100.000000.25266
total5.51393100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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