Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMB20

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMB20SOT363SC-885.51393 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340578881151512601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000002.53902
subTotal0.14000100.000002.53902
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03379
Carbon (C)7440-44-00.000830.040000.01502
Chromium (Cr)7440-47-30.004350.210000.07884
Cobalt (Co)7440-48-40.008900.430000.16143
Iron (Fe)7439-89-60.9811847.4000017.79457
Manganese (Mn)7439-96-50.017600.850000.31910
Nickel (Ni)7440-02-00.7392035.7100013.40599
Phosphorus (P)7723-14-00.000410.020000.00751
Silicon (Si)7440-21-30.005380.260000.09761
Sulphur (S)7704-34-90.000410.020000.00751
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.92166
Silver (Ag)7440-22-40.038501.860000.69827
subTotal2.07000100.0000037.54130
Mould CompoundFillerSilica fused60676-86-02.1929275.1000039.77054
PigmentCarbon black1333-86-40.008760.300000.15887
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.26744
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.75993
subTotal2.92000100.0000052.95678
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.70961
subTotal0.37000100.000006.71029
WirePure metalCopper (Cu)7440-50-80.01393100.000000.25266
subTotal0.01393100.000000.25266
total5.51393100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.