Chemical content PUMB30

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Type numberPackagePackage descriptionTotal product weight
PUMB30SOT363SC-885.51293 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340599331151412601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000002.53948
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03379
Carbon (C)7440-44-00.000830.040000.01502
Chromium (Cr)7440-47-30.004350.210000.07885
Cobalt (Co)7440-48-40.008900.430000.16146
Iron (Fe)7439-89-60.9811847.4000017.79780
Manganese (Mn)7439-96-50.017600.850000.31916
Nickel (Ni)7440-02-00.7392035.7100013.40842
Phosphorus (P)7723-14-00.000410.020000.00751
Silicon (Si)7440-21-30.005380.260000.09763
Sulphur (S)7704-34-90.000410.020000.00751
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.92255
Silver (Ag)7440-22-40.038501.860000.69839
Mould CompoundFillerSilica fused60676-86-02.1929275.1000039.77776
PigmentCarbon black1333-86-40.008760.300000.15890
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.26912
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.76061
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.71082
WirePure metalCopper (Cu)7440-50-80.01293100.000000.23446
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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