Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMD14

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMD14SOT363SC-885.492926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340589051151312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000001.092314
subTotal0.060000100.0000001.092314
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000001.092314
subTotal0.060000100.0000001.092314
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.033916
Carbon (C)7440-44-00.0008280.0400000.015074
Chromium (Cr)7440-47-30.0043470.2100000.079138
Cobalt (Co)7440-48-40.0089010.4300000.162045
Iron (Fe)7439-89-60.98118047.40000017.862611
Manganese (Mn)7439-96-50.0175950.8500000.320321
Nickel (Ni)7440-02-00.73919735.71000013.457254
Phosphorus (P)7723-14-00.0004140.0200000.007537
Silicon (Si)7440-21-30.0053820.2600000.097981
Sulphur (S)7704-34-90.0004140.0200000.007537
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.940482
Silver (Ag)7440-22-40.0385021.8600000.700938
subTotal2.070000100.00000037.684833
Mould CompoundFillerSilica fused60676-86-02.19292075.10000039.922620
PigmentCarbon black1333-86-40.0087600.3000000.159478
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.302874
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.774309
subTotal2.920000100.00000053.159282
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000202
Bismuth (Bi)7440-69-90.0000040.0010000.000067
Copper (Cu)7440-50-80.0000040.0010000.000067
Lead (Pb)7439-92-10.0000180.0050000.000337
Tin solderTin (Sn)7440-31-50.36996399.9900006.735263
subTotal0.370000100.0000006.735936
WirePure metalCopper (Cu)7440-50-80.012926100.0000000.235316
subTotal0.012926100.0000000.235316
total5.492926100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.