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Chemical content PUSB3BB4

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUSB3BB4SOT1176-2XSON103.07969 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665031471312601235Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveActive agent2-Phenyl-4,5-bis(hydroxymethyl)imidazole61698-32-60.002505.000000.08118
FillerSilica -amorphous-7631-86-90.0300060.000000.97412
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0100020.000000.32471
Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-00.0075015.000000.24353
subTotal0.05000100.000001.62354
DieDoped siliconSilicon (Si)7440-21-30.06400100.000002.07813
subTotal0.06400100.000002.07813
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900029.17842
Magnesium (Mg)7439-95-40.001620.170000.05244
Nickel (Ni)7440-02-00.041044.320001.33260
Silicon (Si)7440-21-30.006740.710000.21902
Pure metal layerGold (Au)7440-57-50.000280.030000.00925
Nickel (Ni)7440-02-00.001040.110000.03393
Palladium (Pd)7440-05-30.000480.050000.01542
Silver (Ag)7440-22-40.000190.020000.00617
subTotal0.95000100.0000030.84725
Mould CompoundFillerSilica -amorphous-7631-86-90.140007.000004.54591
Silica fused60676-86-01.6600083.0000053.90153
PigmentCarbon black1333-86-40.010000.500000.32471
PolymerEpoxy resin systemProprietary0.120006.000003.89650
Phenolic resinProprietary0.070003.500002.27296
subTotal2.00000100.0000064.94161
WireImpurityNon hazardousProprietary0.000000.000050.00000
Silver (Ag)7440-22-40.000000.001450.00001
Pure metalCopper (Cu)7440-50-80.0151496.548550.49176
Pure metal layerGold (Au)7440-57-50.000070.449960.00229
Palladium (Pd)7440-05-30.000472.999700.01528
subTotal0.01569100.000000.50934
total3.07969100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.