Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUSB3TB6

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUSB3TB6SOT1358-1XSON72.64574 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406823847113126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveActive agent2-Phenyl-4,5-bis(hydroxymethyl)imidazole61698-32-60.001505.000000.05669
FillerSilica -amorphous-7631-86-90.0180060.000000.68034
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0060020.000000.22678
Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether119345-05-00.0045015.000000.17008
subTotal0.03000100.000001.13389
DieDoped siliconSilicon (Si)7440-21-30.08000100.000003.02373
subTotal0.08000100.000003.02373
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-80.8536097.0000032.26319
Nickel (Ni)7440-02-00.026403.000000.99783
subTotal0.88000100.0000033.26102
Mould CompoundFillerSilica -amorphous-7631-86-90.112007.000004.23322
Silica fused60676-86-01.3280083.0000050.19390
PigmentCarbon black1333-86-40.008000.500000.30237
PolymerEpoxy resin systemProprietary0.096006.000003.62847
Phenolic resinProprietary0.056003.500002.11661
subTotal1.60000100.0000060.47457
Pre-PlatingPure metal layerGold (Au)7440-57-50.001203.000000.04536
Nickel (Ni)7440-02-00.0369292.300001.39545
Palladium (Pd)7440-05-30.001243.100000.04687
Silver (Ag)7440-22-40.000641.600000.02419
subTotal0.04000100.000001.51187
WirePure metalGold (Au)7440-57-50.0155999.000000.58912
Palladium (Pd)7440-05-30.000161.000000.00595
subTotal0.01574100.000000.59507
total2.64574100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.