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Chemical content PXN010-30QL

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Type numberPackagePackage descriptionTotal product weight
PXN010-30QLSOT8002-1MLPAK3321.62750 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661597118312601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01068
FillerSilver (Ag)7440-22-40.1940484.000000.89719
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10681
Isobornyl Methacrylate7534-94-30.011555.000000.05340
subTotal0.23100100.000001.06808
DieDoped siliconSilicon (Si)7440-21-30.39700100.000001.83563
subTotal0.39700100.000001.83563
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100046.02819
Iron (Fe)7439-89-60.235772.300001.09015
Lead (Pb)7439-92-10.001030.010000.00474
Phosphorus (P)7723-14-00.007180.070000.03318
Zinc (Zn)7440-66-60.001030.010000.00474
Pure metal layerSilver (Ag)7440-22-40.051260.500000.23699
subTotal10.25100100.0000047.39799
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.19321
FillerSilica -amorphous-7631-86-90.029560.290000.13666
Silica fused60676-86-08.7804186.1500040.59835
HardenerPhenolic resinProprietary0.437244.290002.02167
PigmentCarbon black1333-86-40.019360.190000.08954
PolymerEpoxy resin systemProprietary0.883658.670004.08575
subTotal10.19200100.0000047.12518
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00102
Tin solderTin (Sn)7440-31-50.3987699.940001.84377
subTotal0.39900100.000001.84487
WireImpurityNon hazardousProprietary0.000020.010000.00007
Pure metalCopper (Cu)7440-50-80.1574899.990000.72817
subTotal0.15750100.000000.72824
total21.62750100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.