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Chemical content PXN011-100QL

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Type numberPackagePackage descriptionTotal product weight
PXN011-100QLSOT8002-1MLPAK3323.50070 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934665767118312601260Shaoxing Zhejiang, China; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.00983
FillerSilver (Ag)7440-22-40.1940484.000000.82568
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.09829
Isobornyl Methacrylate7534-94-30.011555.000000.04915
subTotal0.23100100.000000.98295
DieDoped siliconSilicon (Si)7440-21-32.13195100.000009.07186
subTotal2.13195100.000009.07186
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100042.35936
Iron (Fe)7439-89-60.235772.300001.00326
Lead (Pb)7439-92-10.001030.010000.00436
Phosphorus (P)7723-14-00.007180.070000.03053
Zinc (Zn)7440-66-60.001030.010000.00436
Pure metal layerSilver (Ag)7440-22-40.051260.500000.21810
subTotal10.25100100.0000043.61997
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.17781
FillerSilica -amorphous-7631-86-90.029560.290000.12577
Silica fused60676-86-08.7804186.1500037.36233
HardenerPhenolic resinProprietary0.437244.290001.86053
PigmentCarbon black1333-86-40.019360.190000.08240
PolymerEpoxy resin systemProprietary0.883658.670003.76009
subTotal10.19200100.0000043.36893
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00094
Tin solderTin (Sn)7440-31-50.3987699.940001.69680
subTotal0.39900100.000001.69782
WireImpurityNon hazardousProprietary0.000030.010000.00013
Pure metalCopper (Cu)7440-50-80.2957299.990001.25835
subTotal0.29575100.000001.25848
total23.50070100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.