Chemical content PXN012-100QL

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Type numberPackagePackage descriptionTotal product weight
PXN012-100QLSOT8002-1MLPAK3323.21411 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666353118212601260Shaoxing Zhejiang, China; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.00995
FillerSilver (Ag)7440-22-40.1940484.000000.83587
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.09951
Isobornyl Methacrylate7534-94-30.011555.000000.04975
DieDoped siliconSilicon (Si)7440-21-31.84536100.000007.94930
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100042.88231
Iron (Fe)7439-89-60.235772.300001.01565
Lead (Pb)7439-92-10.001030.010000.00442
Phosphorus (P)7723-14-00.007180.070000.03091
Zinc (Zn)7440-66-60.001030.010000.00442
Pure metal layerSilver (Ag)7440-22-40.051260.500000.22079
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.18001
FillerSilica -amorphous-7631-86-90.029560.290000.12732
Silica fused60676-86-08.7804186.1500037.82358
HardenerPhenolic resinProprietary0.437244.290001.88350
PigmentCarbon black1333-86-40.019360.190000.08342
PolymerEpoxy resin systemProprietary0.883658.670003.80651
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00095
Tin solderTin (Sn)7440-31-50.3987699.940001.71775
WireImpurityNon hazardousProprietary0.000030.010000.00013
Pure metalCopper (Cu)7440-50-80.2957299.990001.27388
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.