Chemical content PXN5R4-30QL

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Type numberPackagePackage descriptionTotal product weight
PXN5R4-30QLSOT8002-1MLPAK3322.22825 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662885118312601235Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01039
FillerSilver (Ag)7440-22-40.1940484.000000.87294
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10392
Isobornyl Methacrylate7534-94-30.011555.000000.05196
DieDoped siliconSilicon (Si)7440-21-30.91900100.000004.13438
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100044.78421
Iron (Fe)7439-89-60.235772.300001.06069
Lead (Pb)7439-92-10.001030.010000.00461
Phosphorus (P)7723-14-00.007180.070000.03228
Zinc (Zn)7440-66-60.001030.010000.00461
Pure metal layerSilver (Ag)7440-22-40.051260.500000.23058
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.18799
FillerSilica -amorphous-7631-86-90.029560.290000.13297
Silica fused60676-86-08.7804186.1500039.50112
HardenerPhenolic resinProprietary0.437244.290001.96703
PigmentCarbon black1333-86-40.019360.190000.08712
PolymerEpoxy resin systemProprietary0.883658.670003.97533
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00100
Tin solderTin (Sn)7440-31-50.3987699.940001.79394
WireImpurityNon hazardousProprietary0.000020.010000.00011
Pure metalCopper (Cu)7440-50-80.2362399.990001.06273
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.