Chemical content PXP015-30QL

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Type numberPackagePackage descriptionTotal product weight
PXP015-30QLSOT8002-1MLPAK3321.78225 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663639118312601235Kwai Chung, Hong Kong; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01060
FillerSilver (Ag)7440-22-40.1940484.000000.89082
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10605
Isobornyl Methacrylate7534-94-30.011555.000000.05302
DieDoped siliconSilicon (Si)7440-21-30.47300100.000002.17149
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100045.70118
Iron (Fe)7439-89-60.235772.300001.08241
Lead (Pb)7439-92-10.001030.010000.00471
Phosphorus (P)7723-14-00.007180.070000.03294
Zinc (Zn)7440-66-60.001030.010000.00471
Pure metal layerSilver (Ag)7440-22-40.051260.500000.23531
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.19184
FillerSilica -amorphous-7631-86-90.029560.290000.13569
Silica fused60676-86-08.7804186.1500040.30992
HardenerPhenolic resinProprietary0.437244.290002.00731
PigmentCarbon black1333-86-40.019360.190000.08890
PolymerEpoxy resin systemProprietary0.883658.670004.05673
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00102
Tin solderTin (Sn)7440-31-50.3987699.940001.83067
WireImpurityNon hazardousProprietary0.000020.010000.00011
Pure metalCopper (Cu)7440-50-80.2362399.990001.08449
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.