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Chemical content PXP018-20QX

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Type numberPackagePackage descriptionTotal product weight
PXP018-20QXSOT8002-1MLPAK3321.90425 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662543118212601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01055
FillerSilver (Ag)7440-22-40.1940484.000000.88586
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10546
Isobornyl Methacrylate7534-94-30.011555.000000.05273
subTotal0.23100100.000001.05460
DieDoped siliconSilicon (Si)7440-21-30.59500100.000002.71637
subTotal0.59500100.000002.71637
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100045.44664
Iron (Fe)7439-89-60.235772.300001.07638
Lead (Pb)7439-92-10.001030.010000.00468
Phosphorus (P)7723-14-00.007180.070000.03276
Zinc (Zn)7440-66-60.001030.010000.00468
Pure metal layerSilver (Ag)7440-22-40.051260.500000.23400
subTotal10.25100100.0000046.79914
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.19077
FillerSilica -amorphous-7631-86-90.029560.290000.13494
Silica fused60676-86-08.7804186.1500040.08541
HardenerPhenolic resinProprietary0.437244.290001.99613
PigmentCarbon black1333-86-40.019360.190000.08841
PolymerEpoxy resin systemProprietary0.883658.670004.03413
subTotal10.19200100.0000046.52979
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00101
Tin solderTin (Sn)7440-31-50.3987699.940001.82047
subTotal0.39900100.000001.82156
WireImpurityNon hazardousProprietary0.000020.010000.00011
Pure metalCopper (Cu)7440-50-80.2362399.990001.07845
subTotal0.23625100.000001.07856
total21.90425100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.