×

Chemical content PXP8R3-20QX

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PXP8R3-20QXSOT8002-1MLPAK3322.78225 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662546118212601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.002311.000000.01014
FillerSilver (Ag)7440-22-40.1940484.000000.85172
PolymerBismaleimidodiphenylmethane resin 0.0231010.000000.10139
Isobornyl Methacrylate7534-94-30.011555.000000.05070
subTotal0.23100100.000001.01395
DieDoped siliconSilicon (Si)7440-21-31.47300100.000006.46556
subTotal1.47300100.000006.46556
Lead FrameCopper alloyCopper (Cu)7440-50-89.9547597.1100043.69518
Iron (Fe)7439-89-60.235772.300001.03490
Lead (Pb)7439-92-10.001030.010000.00450
Phosphorus (P)7723-14-00.007180.070000.03150
Zinc (Zn)7440-66-60.001030.010000.00450
Pure metal layerSilver (Ag)7440-22-40.051260.500000.22498
subTotal10.25100100.0000044.99556
Mould CompoundAdditiveNon hazardousProprietary0.041790.410000.18342
FillerSilica -amorphous-7631-86-90.029560.290000.12974
Silica fused60676-86-08.7804186.1500038.54057
HardenerPhenolic resinProprietary0.437244.290001.91920
PigmentCarbon black1333-86-40.019360.190000.08500
PolymerEpoxy resin systemProprietary0.883658.670003.87866
subTotal10.19200100.0000044.73659
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00008
Non hazardousProprietary0.000220.055500.00097
Tin solderTin (Sn)7440-31-50.3987699.940001.75031
subTotal0.39900100.000001.75136
WireImpurityNon hazardousProprietary0.000020.010000.00010
Pure metalCopper (Cu)7440-50-80.2362399.990001.03689
subTotal0.23625100.000001.03699
total22.78225100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.