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Chemical content RB520CS3002L

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Type numberPackagePackage descriptionTotal product weight
RB520CS3002LSOD882DFN1006-20.92360 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067837303112601235D-22529 HAMBURG, Germany; Dongguan, China 
934067837315312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82287
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11336
Phenolic resinProprietary0.0013513.530000.14649
subTotal0.01000100.000001.08272
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24816
subTotal0.03000100.000003.24816
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.94554
Magnesium (Mg)7439-95-40.000820.200000.08878
Nickel (Ni)7440-02-00.012923.150001.39833
Silicon (Si)7440-21-30.002830.690000.30630
Pure metal layerGold (Au)7440-57-50.000120.030000.01332
Nickel (Ni)7440-02-00.005211.270000.56377
Palladium (Pd)7440-05-30.000700.170000.07547
subTotal0.41000100.0000044.39151
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.20615
Silica fused60676-86-00.2700060.0000029.23343
Flame retardantMetal hydroxideProprietary0.013503.000001.46167
ImpurityBismuth (Bi)7440-69-90.002250.500000.24361
PigmentCarbon black1333-86-40.002250.500000.24361
PolymerEpoxy resin systemProprietary0.031507.000003.41057
Phenolic resinProprietary0.027006.000002.92334
subTotal0.45000100.0000048.72238
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16414
subTotal0.02000100.000002.16544
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0036099.990000.38963
subTotal0.00360100.000000.38967
total0.92360100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.