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Chemical content RB751CS40

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Type numberPackagePackage descriptionTotal product weight
RB751CS40SOD882DFN1006-20.93348 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340613043151312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.81416
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11216
Phenolic resinProprietary0.0013513.530000.14494
subTotal0.01000100.000001.07126
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.28504
subTotal0.04000100.000004.28504
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.50159
Magnesium (Mg)7439-95-40.000820.200000.08784
Nickel (Ni)7440-02-00.012923.150001.38353
Silicon (Si)7440-21-30.002830.690000.30306
Pure metal layerGold (Au)7440-57-50.000120.030000.01318
Nickel (Ni)7440-02-00.005211.270000.55781
Palladium (Pd)7440-05-30.000700.170000.07467
subTotal0.41000100.0000043.92168
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.08754
Silica fused60676-86-00.2700060.0000028.92403
Flame retardantMetal hydroxideProprietary0.013503.000001.44620
ImpurityBismuth (Bi)7440-69-90.002250.500000.24103
PigmentCarbon black1333-86-40.002250.500000.24103
PolymerEpoxy resin systemProprietary0.031507.000003.37447
Phenolic resinProprietary0.027006.000002.89240
subTotal0.45000100.0000048.20670
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00119
Tin solderTin (Sn)7440-31-50.0199999.940002.14123
subTotal0.02000100.000002.14252
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0034899.990000.37244
subTotal0.00348100.000000.37248
total0.93348100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.