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Chemical content XC7SET125GM

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Type numberPackagePackage descriptionTotal product weight
XC7SET125GMSOT886XSON61.92082 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289889132712601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
935289889115512601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.05520100.000002.87396
subTotal0.05520100.000002.87396
ComponentAdditiveNon hazardousProprietary0.000255.000000.01302
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01302
Silica -amorphous-7631-86-90.0025050.000000.13015
PolymerEpoxy resin systemProprietary0.0015030.000000.07809
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02603
subTotal0.00500100.000000.26031
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.98467
Magnesium (Mg)7439-95-40.001160.150000.06029
Nickel (Ni)7440-02-00.022772.950001.18564
Silicon (Si)7440-21-30.004940.640000.25722
Pure metal layerGold (Au)7440-57-50.000150.020000.00804
Nickel (Ni)7440-02-00.012661.640000.65914
Palladium (Pd)7440-05-30.000690.090000.03617
subTotal0.77200100.0000040.19117
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22754
FillerSilica -amorphous-7631-86-90.003090.290000.16094
Silica fused60676-86-00.9183686.1500047.81078
HardenerPhenolic resinProprietary0.045734.290002.38083
PigmentCarbon black1333-86-40.002030.190000.10544
PolymerEpoxy resin systemProprietary0.092428.670004.81160
subTotal1.06600100.0000055.49713
WireGold alloyGold (Au)7440-57-50.0223999.000001.16559
Palladium (Pd)7440-05-30.000231.000000.01177
subTotal0.02262100.000001.17736
total1.92082100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.