Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content XC7WH14GT

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Type numberPackagePackage descriptionTotal product weight
XC7WH14GTSOT833-1XSON82.50719 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09916100.000003.95510
ComponentAdditiveNon hazardousProprietary0.000755.000000.02991
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02991
Silica -amorphous-7631-86-90.0075050.000000.29914
PolymerEpoxy resin systemProprietary0.0045030.000000.17948
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05983
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.24486
Magnesium (Mg)7439-95-40.001530.145700.06119
Nickel (Ni)7440-02-00.030682.914001.22386
Silicon (Si)7440-21-30.006650.631400.26518
Pure metal layerGold (Au)7440-57-50.000370.035000.01470
Nickel (Ni)7440-02-00.028562.712001.13902
Palladium (Pd)7440-05-30.001260.120000.05040
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21292
FillerSilica -amorphous-7631-86-90.003780.290000.15060
Silica fused60676-86-01.1216786.1500044.73825
HardenerPhenolic resinProprietary0.055864.290002.22782
PigmentCarbon black1333-86-40.002470.190000.09867
PolymerEpoxy resin systemProprietary0.112888.670004.50239
WireGold alloyGold (Au)7440-57-50.0376499.000001.50147
Palladium (Pd)7440-05-30.000381.000000.01517
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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