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Chemical content XC7WH14GT

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Type numberPackagePackage descriptionTotal product weight
XC7WH14GTSOT833-1XSON82.50719 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935293997115412601235Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09916100.000003.95510
subTotal0.09916100.000003.95510
ComponentAdditiveNon hazardousProprietary0.000755.000000.02991
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02991
Silica -amorphous-7631-86-90.0075050.000000.29914
PolymerEpoxy resin systemProprietary0.0045030.000000.17948
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05983
subTotal0.01500100.000000.59827
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.24486
Magnesium (Mg)7439-95-40.001530.145700.06119
Nickel (Ni)7440-02-00.030682.914001.22386
Silicon (Si)7440-21-30.006650.631400.26518
Pure metal layerGold (Au)7440-57-50.000370.035000.01470
Nickel (Ni)7440-02-00.028562.712001.13902
Palladium (Pd)7440-05-30.001260.120000.05040
subTotal1.05300100.0000041.99921
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21292
FillerSilica -amorphous-7631-86-90.003780.290000.15060
Silica fused60676-86-01.1216786.1500044.73825
HardenerPhenolic resinProprietary0.055864.290002.22782
PigmentCarbon black1333-86-40.002470.190000.09867
PolymerEpoxy resin systemProprietary0.112888.670004.50239
subTotal1.30200100.0000051.93065
WireGold alloyGold (Au)7440-57-50.0376499.000001.50147
Palladium (Pd)7440-05-30.000381.000000.01517
subTotal0.03802100.000001.51664
total2.50719100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.