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Chemical content XS3A1T3157GM

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Type numberPackagePackage descriptionTotal product weight
XS3A1T3157GMSOT886XSON62.01912 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690968115512601235Shanghai, China; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.15156100.000007.50627
subTotal0.15156100.000007.50627
ComponentAdditiveNon hazardousProprietary0.000255.000000.01238
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01238
Silica -amorphous-7631-86-90.0025050.000000.12382
PolymerEpoxy resin systemProprietary0.0015030.000000.07429
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02476
subTotal0.00500100.000000.24763
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100036.13541
Magnesium (Mg)7439-95-40.001160.150000.05735
Nickel (Ni)7440-02-00.022772.950001.12792
Silicon (Si)7440-21-30.004940.640000.24470
Pure metal layerGold (Au)7440-57-50.000150.020000.00765
Nickel (Ni)7440-02-00.012661.640000.62705
Palladium (Pd)7440-05-30.000690.090000.03441
subTotal0.77200100.0000038.23449
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.21646
FillerSilica -amorphous-7631-86-90.003090.290000.15311
Silica fused60676-86-00.9183686.1500045.48313
HardenerPhenolic resinProprietary0.045734.290002.26492
PigmentCarbon black1333-86-40.002030.190000.10031
PolymerEpoxy resin systemProprietary0.092428.670004.57735
subTotal1.06600100.0000052.79528
WireGold alloyGold (Au)7440-57-50.0243199.000001.20421
Palladium (Pd)7440-05-30.000251.000000.01216
subTotal0.02456100.000001.21637
total2.01912100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.