BC857XQC Series
45 V, 100 mA PNP general-purpose transistors
PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Type number | Package | NPN complement: | |
|---|---|---|---|
Nexperia | JEDEC | ||
BC857AQC | SOT8009 | MO-340CA | BC847AQC |
BC857BQC | BC847BQC | ||
BC857CQC | BC847CQC | ||
Features and benefits
High power dissipation capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
Applications
General-purpose switching and amplification
Space restricted applications
Parametrics
| Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC857AQC | SOT8009 | DFN1412D-3 | 1.4 x 1.2 x 0.48 | PNP | 360.0 | -45.0 | -100.0 | 125.0 | 250.0 | 150 | 100.0 | N |
| BC857BQC | SOT8009 | DFN1412D-3 | 1.4 x 1.2 x 0.48 | PNP | 360.0 | -45.0 | -100.0 | 220.0 | 475.0 | 150 | 100.0 | N |
| BC857CQC | SOT8009 | DFN1412D-3 | 1.4 x 1.2 x 0.48 | PNP | 360.0 | -45.0 | -100.0 | 420.0 | 800.0 | 150 | 100.0 | N |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BC857AQC | BC857AQCZ (934660887147) |
Active | 9F |
DFN1412D-3 (SOT8009) |
SOT8009 |
REFLOW_BG-BD-1
|
SOT8009_147 |
| BC857BQC | BC857BQCZ (934660888147) |
Active | 9G |
DFN1412D-3 (SOT8009) |
SOT8009 |
REFLOW_BG-BD-1
|
SOT8009_147 |
| BC857CQC | BC857CQCZ (934660889147) |
Active | 9H |
DFN1412D-3 (SOT8009) |
SOT8009 |
REFLOW_BG-BD-1
|
SOT8009_147 |
Documentation (9)
| File name | Title | Type | Date |
|---|---|---|---|
| BC857XQC_SER | 45 V, 100 mA PNP general-purpose transistor | Data sheet | 2021-10-27 |
| AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
| AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
| SOT8009 | 3D model for products with SOT8009 package | Design support | 2023-02-02 |
| Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
| SOT8009 | plastic, leadless ultra small outline package with side-wettable flanks (SWF);3 terminals; 0.8 mm pitch; 1.4 mm x 1.2 mm x 0.48 mm body | Package information | 2020-12-14 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8009 | 3D model for products with SOT8009 package | Design support | 2023-02-02 |
Sample
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