Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP4_SOT8113 | WLCSP4 | WLCSP4: wafer level chip-size package; 4 bumps | 2025-09-30 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP4_SOT8113 | 3D model for products with WLCSP4_SOT8113 package | Design support | 2025-11-06 |
| WLCSP4_SOT8113 | WLCSP4: wafer level chip-size package; 4 bumps | Package information | 2025-10-16 |
| WLCSP4_SOT8113_336 | WLCSP4; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2025-10-16 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|