×

OL-IP3319CX6

WLCSP6 (OL-IP3319CX6)

Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body

Package information

Package version Package name Package description Reference Issue date
OL-IP3319CX6 WLCSP6 Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body 2013-06-11

Related documents

File name Title Type Date
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

Products in this package

ESD protection, TVS, filtering and signal conditioning
Type number Description Quick access
IP3319CX6 Single-channel common-mode filter with integrated ESD protection network