A wide range of bipolar transistors helps you easily fulfil your system requirements. That includes simple bipolar building blocks and a comprehensive range of space and cost saving resistor-equipped transistors right up to our Breakthrough In Small Signal series of low VCEsat devices.
Our extensive diode portfolio offers the flexibility you need in today's market - whether it is a simple Zener, a highly efficient Schottky rectifier, a fast recovery or controlled avalanche switching diode.
Covering ESD protection and TVS devices as well as common-mode choke and EMI filtering, Nexperia's protection technologies continue to evolve to offer the highest level of protection in the industry's smallest packages.
Nexperia offers a broad portfolio of low- / middle-voltage (12-200 V) P- and N-channel silicon MOSFETs in a wide range of space-saving and efficient package options.
Raising the bar for robust and reliable power switching, Nexperia’s Silicon Carbide (SiC) diodes and MOSFETs are ideal for EV charging infrastructure, photovoltaic inverters and motor drives.
For a variety of high-voltage (650 V) and low-voltage (40-150 V) applications Nexperia GaN FETs deliver the fastest transition / switching capability , best power efficiency and enhanced power density through reduced conduction and switching losses.
Addressing the growing demand for efficient, high-voltage power conversion and motor drives, Nexperia's IGBTs feature a robust and cost-effective carrier stored trench-gate (CSTBT) advanced field-stop (FS) construction.
Alongside a comprehensive portfolio of logic functions, analog switches and I²C interface portfolio, Nexperia delivers a grwoing range of power ICs that enable innovative solutions focused on reducing our customer’s BOM cost, improving system efficiency and robustness.
Helping enable connected electric and hybrid vehicles, Nexperia's offers fully qualified AEC-Q100/Q101 devices from across our complete portfolio of energy- and design-efficient products.
wafer level chip-scale package; 6 bumps; 1.47 × 0.97 × 0.352 mm body
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP | wafer level chip-scale package; 6 bumps; 1.47 × 0.97 × 0.352 mm body | 2023-11-11 |
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