SOT1454-1

WLCSP6 (SOT1454-1)

wafer level chip-scale package, 6 bumps

Outline drawing

Package version Package name Package description Reference Issue date
SOT1454-1 WLCSP6 wafer level chip-scale package, 6 bumps 2016-03-02

Related documents

File name Title Type Date
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03

Products in this package

Logic
Type number Description Quick access
74AUP1G34UK Low-power buffer
74AUP1G97UK Low-power configurable multiple function gate
74AUP1T97UK Low-power configurable gate with voltage-level translator