Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT1454-1 | WLCSP6 | wafer level chip-scale package, 6 bumps | 2016-03-02 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|