SSOP16 (SOT338-1)

plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body

Package version	Package name	Package description	Reference	Issue date
SOT338-1	SSOP16	plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body	MO-150 (JEDEC)	2003-02-19

File name	Title	Type	Date
SSOP16_SOT338-1_mk	plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body	Marcom graphics	2017-01-28
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
SSOP-TSSOP-VSO-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08
Nexperia_package_poster	Nexperia package poster	Leaflet	2019-03-01

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