Package information
SOT338-1 | SSOP16 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | MO-150 (JEDEC) | 2003-02-19 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2019-03-01 |
Products in this package
Analog & Logic ICs | ||
---|---|---|
Type number | Description | Quick access |
74HCT4046ADB | Phase-locked-loop with VCO |