Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8076-1 | HWQFN16 | plastic thermal enhanced very very thin Quad Flat packages; no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | MO-220 (WEED-4) (JEDEC) | 2023-03-20 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8076-1 | plastic thermal enhanced very very thin Quad Flat packages;no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | Package information | 2023-03-28 |
| SOT8076-1_118 | HWQFN16; Reel pack for SMD; 13"; Q1/T1 product orientation | Packing information | 2023-04-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEH2000BY | Energy harvesting PMIC |