WLCSP10_4-2-4

WLCSP10 (WLCSP10_4-2-4)

wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body

Package information

Package version Package name Package description Reference Issue date
WLCSP10_4-2-4 WLCSP10 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body 2010-02-11

Related documents

File name Title Type Date
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

Products in this package

ESD protection, TVS, filtering and signal conditioning
Type number Description Quick access
PCMF2HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF2HDMI2S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF2USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PCMF2USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF2USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF2USB3S Common-mode EMI filter for differential channels with integrated ESD protection
PESD2USB30 ESD protection for differential data lines
PESD2USB3B ESD protection for differential data lines
PESD2USB3S ESD protection for differential data lines