Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP25_5X5 | WLCSP25 | wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body | 2010-02-11 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP25_5X5 | wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body | Package information | 2020-04-21 |
Products in this package
ESD protection, TVS, filtering and signal conditioning
| Type number | Description | Quick access |
|---|