WLCSP25_5X5

WLCSP25 (WLCSP25_5X5)

wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body

Outline drawing

Package version Package name Package description Reference Issue date
WLCSP25_5X5 WLCSP25 wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body 2010-02-11

Related documents

File name Title Type Date
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

Products in this package

ESD protection, TVS, filtering and signal conditioning
Type number Description Quick access
IP4856CX25 SD 3.0-compliant memory card integrated dual voltage level translator with EMI filter and ESD protection