Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP25_SOT8117 | WLCSP25 | WLCSP25: wafer level chip-size package; 25 bumps | 2025-05-12 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP25_SOT8117 | WLCSP25: wafer level chip-size package; 25 bumps | Package information | 2025-10-20 |
| WLCSP25_SOT8117_336 | WLCSP25; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2025-10-16 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX10058UNL | 850 mA tripple-output AMOLED display power supply |