×

WLCSP5_2-1-2

WLCSP5_2-1-2

wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body

Package information

Package information Package name Package description Reference Date
WLCSP5_2-1-2 WLCSP5 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body 2010-02-11

Related documents

File name Title Type Date
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP5_PCMF_PESD1USB3X_PCMF1HDMI2X_087 PCMF1USB3X, PCMF1HDMI2X and PESD1USB3X; H600; Reel pack, SMD, 7" Q2/T3 turned product orientation Orderable part number ending ,087 or Z Ordering code (12NC) ending 087 Packing 2016-05-24

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access
PESD1USB3B ESD protection for differential data lines
PCMF1USB3B Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
PCMF1USB3S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF1USB30 Common-mode EMI filter for differential channels with integrated ESD protection
PESD1USB30 ESD protection for differential data lines
PCMF1HDMI14S Common-mode EMI filter for differential channels with integrated ESD protection
PCMF1HDMI2S Common-mode EMI filter for differential channels with integrated ESD protection
PESD1USB3S ESD protection for differential data lines
PCMF1USB3BA Common-mode EMI filter for differential channels with integrated bidirectional ESD protection